Half-sliced silicon wafer
Minority carrier lifetime: ≥800us
Resistivity: 0.3-2.1 Ω.cm
Carbon content: ≤1ppma
Oxygen content ≤14ppma
182 silicon wafers
Dimension:182*91±0.15mm
Conductivity type: N type
210 silicon wafers
Dimension:210*105±0.15mm
Conductivity type: N type
Customized silicon wafers
Material properties
Item
Specification
Growth mode
CZ
Crystal orientation
<100>±3°
Conductivity type
N type
Dislocation density
≤500
Electrical properties
Item
Specification
Testing method
Oxygen content
≤14ppma
Fourier transform infrared spectrometer
Carbon content
≤1ppma
Fourier transform infrared spectrometer
Resistivity
0.3-2.1Ω.cm
Automatic silicon wafer detection equipment
Minority carrier lifetime
≥800us
Sinton BCT-400 QSSPC
Sinton BCT-400 QSSPC quasi-steady-state photoconductance decay method
Transient(with injection level: 1E15 cm-3)
Transient photoconductance decay method (with injection level: 1E1…