High Thermal Conductivity DBC Ceramic Substrate

High Thermal Conductivity DBC Ceramic Substrate   This substrate utilizes aluminum nitride (AlN) or silicon carbide (SiC) ceramics with thermal conductivity up to 300 W/mK, bonded to copper layers for superior heat dissipation. Designed for high-power electronics like EV inverters and SiC/GaN modules, it ensures efficient thermal management, electrical insulation, and reliable performance in extreme conditions. Its low thermal expansion and robust structure support miniaturization and extended lifespan in advanced automotive, industrial, and renewable energy systems. DBC Substrate is mainly used in the fields of rail transit, smart grid, new energy vehicles, industrial frequency conversion, household appliances, military power electronics, wind and photovoltaic power generation. The material we use in DBC Substrate is Ceramic-based double-sided copper clad laminate, double-sided etching of different graphics, the thickness of copper clad laminate is 0.3 mm-0.8mm. We use fine metal etch…

Cutting Die OLED Glass Cover Eliminator DBC Substrate Computer Accessories