Aluminum base copper clad laminate

Aluminum base copper clad laminate Product Overview Aluminum base copper clad laminate is a high-performance metal-core PCB Base Material that integrates a high-purity copper foil layer with a rugged aluminum substrate. As one of the premium Quality Base Materials, it combines excellent electrical conductivity, ultra-high thermal conductivity, lightweight structure and strong mechanical stability, making it the ideal choice for high-power, heat-dissipation-critical electronic applications. Key Features Outstanding thermal conductivity for efficient heat dissipation, a core advantage of this Base Material High electrical conductivity and stable power transmission, meeting standards of Quality Base Materials Lightweight aluminum substrate with high mechanical strength, a highlight of reliable Base Material Excellent corrosion resistance and environmental durability, typical of Durable Base Materials Good formability, bendable and processable, enhancing usability of this Base Material H…

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